關(guān)于我們
致力于高端芯片封裝技術(shù)研發(fā)與產(chǎn)業(yè)化，提供高端芯片封裝設(shè)計(jì)與仿真、研發(fā)與批量生產(chǎn)、測試與可靠性等一站式服務(wù)。
- 國家專精特新小巨人解決“多、高、大”芯片封裝問題
- 國家級高新技術(shù)企業(yè)、國家級專精特新“小巨人”企業(yè)
- 湖南省及長沙市重大科技揭榜掛帥項(xiàng)目承擔(dān)單位
成立時間
專利授權(quán)
公司人數(shù)
創(chuàng)新技術(shù)
封裝服務(wù)
擅長大尺寸芯片倒裝FC封裝和高功率密度芯片SiP封裝
產(chǎn)品廣泛應(yīng)用于高端服務(wù)器、人工智能、5G通訊和移動終端等諸多領(lǐng)域
倒裝封裝(FC)
大芯片
高算力
高頻率
高密度
SIP封裝
多芯片
多疊層
高功率
高可靠性
焊接封裝(WB)
全線型
薄芯片
小焊球
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8e693354-506a-4bc7-9d89-f579bc01c6b0.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 大芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/bb2a3422-92c5-4b44-9d14-75cb3fb72fbe.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高算力</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/64880b9c-88a3-4ddf-9972-7475e363fc7d.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高頻率</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/290f9034-aa87-4b8f-828f-afb663b4d550.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高密度</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8e693354-506a-4bc7-9d89-f579bc01c6b0.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 大芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/bb2a3422-92c5-4b44-9d14-75cb3fb72fbe.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高算力</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/64880b9c-88a3-4ddf-9972-7475e363fc7d.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高頻率</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/290f9034-aa87-4b8f-828f-afb663b4d550.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高密度</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8e693354-506a-4bc7-9d89-f579bc01c6b0.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 大芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/bb2a3422-92c5-4b44-9d14-75cb3fb72fbe.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高算力</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/64880b9c-88a3-4ddf-9972-7475e363fc7d.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高頻率</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/290f9034-aa87-4b8f-828f-afb663b4d550.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高密度</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8e693354-506a-4bc7-9d89-f579bc01c6b0.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 大芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/bb2a3422-92c5-4b44-9d14-75cb3fb72fbe.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高算力</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/64880b9c-88a3-4ddf-9972-7475e363fc7d.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高頻率</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/290f9034-aa87-4b8f-828f-afb663b4d550.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高密度</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8e693354-506a-4bc7-9d89-f579bc01c6b0.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 大芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/bb2a3422-92c5-4b44-9d14-75cb3fb72fbe.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高算力</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/64880b9c-88a3-4ddf-9972-7475e363fc7d.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高頻率</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/290f9034-aa87-4b8f-828f-afb663b4d550.png" style="max-width: 100%;" alt="倒裝封裝(FC)" /> 高密度</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/db9b94d7-a79e-4ef1-af6f-6b981fdb0533.png" style="max-width: 100%;" alt="SIP封裝" /> 多芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8b9169da-3c5d-4abf-861f-24b0b2bcc3fb.png" style="max-width: 100%;" alt="SIP封裝"/> 多疊層</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a922becb-8968-49aa-8d2d-5bb6e45e2e4e.png" style="max-width: 100%;" alt="SIP封裝"/> 高功率</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/f8a3c974-71dd-4ba4-a7f1-311b558299eb.png" style="max-width: 100%;" alt="SIP封裝"/> 高可靠性</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/db9b94d7-a79e-4ef1-af6f-6b981fdb0533.png" style="max-width: 100%;" alt="SIP封裝" /> 多芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8b9169da-3c5d-4abf-861f-24b0b2bcc3fb.png" style="max-width: 100%;" alt="SIP封裝"/> 多疊層</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a922becb-8968-49aa-8d2d-5bb6e45e2e4e.png" style="max-width: 100%;" alt="SIP封裝"/> 高功率</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/f8a3c974-71dd-4ba4-a7f1-311b558299eb.png" style="max-width: 100%;" alt="SIP封裝"/> 高可靠性</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/db9b94d7-a79e-4ef1-af6f-6b981fdb0533.png" style="max-width: 100%;" alt="SIP封裝" /> 多芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8b9169da-3c5d-4abf-861f-24b0b2bcc3fb.png" style="max-width: 100%;" alt="SIP封裝"/> 多疊層</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a922becb-8968-49aa-8d2d-5bb6e45e2e4e.png" style="max-width: 100%;" alt="SIP封裝"/> 高功率</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/f8a3c974-71dd-4ba4-a7f1-311b558299eb.png" style="max-width: 100%;" alt="SIP封裝"/> 高可靠性</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/db9b94d7-a79e-4ef1-af6f-6b981fdb0533.png" style="max-width: 100%;" alt="SIP封裝" /> 多芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8b9169da-3c5d-4abf-861f-24b0b2bcc3fb.png" style="max-width: 100%;" alt="SIP封裝"/> 多疊層</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a922becb-8968-49aa-8d2d-5bb6e45e2e4e.png" style="max-width: 100%;" alt="SIP封裝"/> 高功率</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/f8a3c974-71dd-4ba4-a7f1-311b558299eb.png" style="max-width: 100%;" alt="SIP封裝"/> 高可靠性</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/db9b94d7-a79e-4ef1-af6f-6b981fdb0533.png" style="max-width: 100%;" alt="SIP封裝" /> 多芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8b9169da-3c5d-4abf-861f-24b0b2bcc3fb.png" style="max-width: 100%;" alt="SIP封裝"/> 多疊層</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a922becb-8968-49aa-8d2d-5bb6e45e2e4e.png" style="max-width: 100%;" alt="SIP封裝"/> 高功率</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/f8a3c974-71dd-4ba4-a7f1-311b558299eb.png" style="max-width: 100%;" alt="SIP封裝"/> 高可靠性</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a6041664-a176-4684-b3e5-6f7237813db4.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 全線型</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/b4034623-d811-476f-8e5b-b1976be3b878.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 薄芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/74388171-157e-41df-be2a-558385d7cd3c.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 小焊球</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a6041664-a176-4684-b3e5-6f7237813db4.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 全線型</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/b4034623-d811-476f-8e5b-b1976be3b878.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 薄芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/74388171-157e-41df-be2a-558385d7cd3c.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 小焊球</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a6041664-a176-4684-b3e5-6f7237813db4.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 全線型</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/b4034623-d811-476f-8e5b-b1976be3b878.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 薄芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/74388171-157e-41df-be2a-558385d7cd3c.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 小焊球</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a6041664-a176-4684-b3e5-6f7237813db4.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 全線型</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/b4034623-d811-476f-8e5b-b1976be3b878.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 薄芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/74388171-157e-41df-be2a-558385d7cd3c.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 小焊球</p>
<p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a6041664-a176-4684-b3e5-6f7237813db4.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 全線型</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/b4034623-d811-476f-8e5b-b1976be3b878.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 薄芯片</p> <p><img src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/74388171-157e-41df-be2a-558385d7cd3c.png" style="max-width: 100%;" alt="焊接封裝(WB)" /> 小焊球</p>
封裝技術(shù)
3D-SiP、FC-SiP以及多物理域協(xié)同設(shè)計(jì)仿真技術(shù)。
安牧泉的設(shè)計(jì)團(tuán)隊(duì)在移動、網(wǎng)絡(luò)、計(jì)算機(jī)、消費(fèi)類和汽車等電子產(chǎn)品市場擁有豐富設(shè)計(jì)/仿真經(jīng)驗(yàn)。
涵蓋了層壓板、打線類、倒裝類和系統(tǒng)級封裝設(shè)計(jì),包括單模、多模、封裝上封裝(PoP)、集成無源器件(IPD)和先進(jìn)的三維系統(tǒng)級封裝(SiP)。
通過與客戶精誠合作,以提供在性能、質(zhì)量、周期和成本等方面最好的產(chǎn)品,幫助客戶確定其產(chǎn)品的最佳封裝方案。
設(shè)計(jì)和仿真團(tuán)隊(duì)與客戶密切合作,協(xié)同設(shè)計(jì)使半導(dǎo)體封裝滿足熱和電氣性能要求。
可靠性是指通過各種環(huán)境試驗(yàn)設(shè)備模擬氣候環(huán)境中的溫濕度及其變化等情況,加速反應(yīng)產(chǎn)品在使用環(huán)境中的狀況,來驗(yàn)證其是否達(dá)到在研發(fā)、設(shè)計(jì)、制造中預(yù)期的質(zhì)量目標(biāo),從而對產(chǎn)品整體進(jìn)行評估,以確定產(chǎn)品性能與壽命。
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